Description
• Up to 23% module e ciency with high density interconnect
technology
• Multi-busbar technology for better light trapping e ect, lower series
resistance and improved current collection
• Minimized micro-cracks with innovative non-destructive cutting
technology
• Ensured PID resistance through cell process and module material
control and re class rating C
• Resistant to harsh environments such as salt, ammonia, sand, high
temperature and high humidity areas
• Mechanical performance up to 5400 Pa positive load and 2400 Pa
negative load
• Excellent IAM (Incident Angle Modi er) and low irradiation
performance, validated by 3rd party certi cations
• The unique design provides optimized energy production under inter-
row shading conditions
• Lower temperature coe cient (-0.30%) and operating temperature
• Up to 30% additional power gain from back side depending on albedo