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Description
Product details of High Quality 55 Kinds of Universal BGA Reballing Stencils Template for Mobile Phone PC IC Chip Solder Paste Tin Plate Net
*100% brand new and high quality*Made of high-quality materials, durable*The multifunctional template basically covers the current general-purpose BGA chips. *It can be heated by an air, and the template is not easily deformed by heat. *The grid design can reduce the waste of solder balls. *Simple and convenient to use. *It solves the trouble when the computer maintenance engineer uses the direct heating steel mesh. It is durable. *The success rate of tin planting is very high, and solder balls can be formed at one time when proficient.
100 brand new and high qualityMade of highquality materials durableThe multifunctional template basically covers the current generalpurpose BGA chipsIt can be heated by an air and the template is not easily deformed by heatThe grid design can reduce the waste of solder ballsSimple and convenient to useIt solves the trouble when the computer maintenance engineer uses the direct heating steel mesh It is durableThe success rate of tin planting is very high and solder balls can be formed at one time when proficient
Listed by private user
Universal Finds (Abdullah)
Member since Nov 2024
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Location
Pakistan
Ad id 1095241699
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